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International Journal of Mechanical and Industrial Engineering

Abstract

Measurements have been conducted for experimentally determining the heat transfer co-efficient of a commercially available heat sink employed in electronic circuits. For determining the heat transfer coefficient the chip is replaced with a heating coil. The power input to the heating coil is obtained by measuring the input voltage and current. Temperature measurement for varying heat inputs is done using RTD thermocouples. Heat transfer co-efficient is computed from the measured data. This is done for different configurations of the heat sink.

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